Copper has excellent physical, thermal properties and electrical conductivity. Copper is easily soldered, welded and plated for corrosion resistance.
Gold plated pure copper is used when electrical conductivity is crucial and its application is critical to maintaining a stable resistance with minimal variation over the wire length.
Copper is available in three grades of Oxygen free (OF), Oxygen free electronic (OFE) and also in grade Electrolytic Tough Pitch (ETP), in both round and milled ribbon forms.
Chemical composition
| | Cu % | Ag % |
|---|
C10100 OFE
Oxygen free electronic |
99.99 |
- |
|---|
C10200 OF
Oxygen free |
99.99 |
min |
|---|
Table represents nominal composition of each grade
Mechanical properties
| | Tensile strength
Rm |
|---|
| | MPa | ksi |
|---|
| Hard |
455 |
66 |
|---|
| Annealed |
220 |
32 |
|---|
Physical properties
| Density g/cm3 (lb/in3) |
8.94 (.323) |
| Electrical resistivity at 20°C Ωmm2/m (Ω circ. mil/ft) |
0.017 (10.2) |
| Temperature coefficient of resistance K-1 |
+0.00397 |
| Conductivity at 20°C (68°F) |
Anealed 101% IACS min |
Coefficient of thermal expansion
| Temperature °C (°F) |
Thermal expansion 10 -6/K (10 -6/°F) |
| 20-500 (68-932) |
17.0 (9.4) |
Thermal conductivity
| Temperature °C (°F) |
100 (212) |
| W m-1 K-1 (Btu h-1 ft-1 °F-1) |
391 (226) |
Specific heat capacity
| Temperature °C (°F) |
20 |
| kJ kg-1 K-1 (Btu lb-1 °F-1) |
0.385 (0.092) |
| Melting Point °C (°F) |
1083 (1981) |
Standards
| Specifications |
ASTM B170, 1, 2, 3, F-68, 272-grade 1 and 2 |
