Disclaimer: Recommendations are for guidance only, and the suitability of a material for a specific application can be confirmed only when we know the actual service conditions. Continuous development may necessitate changes in technical data without notice. This datasheet is only valid for materials under the trademark Kanthal®.
Copper has excellent physical, thermal properties and electrical conductivity. Copper is easily soldered, welded and plated for corrosion resistance.
Gold plated pure copper is used when electrical conductivity is crucial and its application is critical to maintaining a stable resistance with minimal variation over the wire length.
Copper is available in three grades of Oxygen free (OF), Oxygen free electronic (OFE) and also in grade Electrolytic Tough Pitch (ETP), in both round and milled ribbon forms.
Cu %
Ag %
C10100 OFE Oxygen free electronic
99.99
-
C10200 OF Oxygen free
99.99
min
Table represents nominal composition of each grade
Tensile strength Rm
MPa
ksi
Hard
455
66
Annealed
220
32
Density g/cm3 (lb/in3)
8.94 (.323)
Electrical resistivity at 20°C Ωmm2/m (Ω circ. mil/ft)
0.017 (10.2)
Temperature coefficient of resistance K-1
+0.00397
Conductivity at 20°C (68°F)
Anealed 101% IACS min
Coefficient of thermal expansion
Temperature °C (°F)
Thermal expansion 10 -6/K (10 -6/°F)
20-500 (68-932)
17.0 (9.4)
Thermal conductivity
Temperature °C (°F)
100 (212)
W m-1 K-1 (Btu h-1 ft-1 °F-1)
391 (226)
Specific heat capacity
Temperature °C (°F)
20
kJ kg-1 K-1 (Btu lb-1 °F-1)
0.385 (0.092)
Melting Point °C (°F)
1083 (1981)
Specifications
ASTM B170, 1, 2, 3, F-68, 272-grade 1 and 2
Disclaimer: Recommendations are for guidance only, and the suitability of a material for a specific application can be confirmed only when we know the actual service conditions. Continuous development may necessitate changes in technical data without notice. This datasheet is only valid for materials under the trademark Kanthal®.
